IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology...
2 KB (98 words) - 03:54, 31 July 2024
IEEE Access Advanced Packaging, IEEE Transactions on Aerospace and Electronic Systems, IEEE Transactions on Affective Computing, IEEE Transactions on...
19 KB (1,197 words) - 05:44, 13 July 2025
capacitor selection for modern CMOS technology". IEEE Transactions on Advanced Packaging. 22 (3). IEEE: 284–291. doi:10.1109/6040.784476. ISSN 1557-9980...
12 KB (1,201 words) - 13:27, 26 May 2025
integrated circuit (2.5D IC) is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into...
25 KB (2,172 words) - 10:40, 15 July 2025
Electronics Engineers (IEEE) Transactions of Advanced Packaging Commendable Paper Award, 2004 Transactions on Components and Packaging Technologies Best...
5 KB (424 words) - 02:57, 27 June 2025
Surface activated bonding (category Packaging (microfabrication))
electrodes by means of surface-activated bonding (SAB) method". IEEE Transactions on Advanced Packaging. 29 (2): 218–226. doi:10.1109/TADVP.2006.873138. ISSN 1521-3323...
12 KB (1,129 words) - 20:44, 30 December 2024
Directed assembly of micro- and nano-structures (section Self-assembled monolayers on solid substrates)
fabrication of nano-scale electronic and photonic devices". IEEE Transactions on Advanced Packaging. 26 (3): 233–241. doi:10.1109/TADVP.2003.817971. Xu, Feng;...
12 KB (1,563 words) - 02:32, 9 February 2025
Veeco (category Companies listed on the Nasdaq)
the global ALD market. Advanced packaging systems include: Lithography tools used for copper pillar, fan-out wafer-level packaging (FOWLP) through-silicon...
19 KB (1,924 words) - 22:04, 18 July 2025
Semiconductor device fabrication (category Commons category link is on Wikidata)
end, post-fab, ATMP (Assembly, Test, Marking, and Packaging) or ATP (Assembly, Test and Packaging) of semiconductor manufacturing, and may be carried...
112 KB (11,789 words) - 11:25, 15 July 2025
Graphics Player for Constrained Devices". IEEE Transactions on Consumer Electronics. 54 (2). IEEE Transactions on Consumer Electronics (Vol. 54 issue 2):...
13 KB (1,274 words) - 21:13, 18 July 2025
Linda Katehi (category People appearing on C-SPAN)
improving isolation in LTCC RF and wireless multichip packages". IEEE Transactions on Advanced Packaging. 23 (1): 88–99. CiteSeerX 10.1.1.454.5791. doi:10...
79 KB (8,015 words) - 01:01, 2 June 2025
Transportation in Nanotechnology—Potentials and Challenges". IEEE Transactions on Advanced Packaging. 28 (4): 547–555. doi:10.1109/TADVP.2005.858309. S2CID 33608087...
159 KB (18,673 words) - 00:30, 10 July 2025
Synaptic Package Manager provides a graphical user interface by using the Advanced Packaging Tool (apt) library, which, in turn, relies on dpkg for core...
35 KB (2,920 words) - 06:41, 14 July 2025
Three-dimensional integrated circuit (category Packaging (microfabrication))
Weber, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol. 19, No. 4 (1996) "HOME". Archived from the original on December...
81 KB (8,790 words) - 20:42, 18 July 2025
Integrated circuit (category Commons category link is on Wikidata)
techniques are collectively known as advanced packaging. Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as...
82 KB (8,755 words) - 09:16, 14 July 2025
characteristic impedance of planar transmission lines," IEEE Transactions on Advanced Packaging, Vol. 26, pp. 165-171, 2003. (See the biographies at the...
4 KB (381 words) - 00:17, 27 March 2024
Harry Kroger (category Fellows of the IEEE)
IEEE Transactions on Advanced Packaging. 25: 12–17. doi:10.1109/TADVP.2002.1017679. "Inside Binghamton University". Archived from the original on 2006-09-07...
8 KB (655 words) - 08:04, 2 April 2025
micromechanics on silicon: Techniques and devices". IEEE Transactions on Electron Devices. 25 (10). Institute of Electrical and Electronics Engineers (IEEE): 1241–1250...
54 KB (5,864 words) - 06:30, 2 June 2025
Electromagnetic Interference (EMI) of System-on-Package (SOP). Advanced Packaging, IEEE Transactions on. 27. 304 - 314. 10.1109/TADVP.2004.828817. Nandivada...
14 KB (1,899 words) - 09:26, 14 February 2024
Filter Design and Fabrication Using IPD Technology". IEEE Transactions on Components and Packaging Technologies. 30 (4): 556–562. doi:10.1109/TCAPT.2007...
22 KB (2,387 words) - 23:32, 23 May 2025
"IEEE Transactions on Automation Science and Engineering Best New Application Paper Award (Sponsored by Googol Technology Ltd) About the Award". IEEE....
25 KB (2,381 words) - 17:40, 17 July 2025
require single chip packaging. Wafer-level packaging is implemented before wafer dicing, as shown in Fig. 3(a), and is based on anodic, metal diffusion...
33 KB (3,987 words) - 11:38, 12 July 2025
method for modeling circuits and interconnects for electronic packaging," in IEEE Transactions on Microwave Theory and Techniques, vol. 45, no. 10, pp. 1868–74...
12 KB (1,325 words) - 04:25, 17 March 2025
paper in the IEEE Transactions on Nuclear Science journal in 1975. In 1978, the first evidence of soft errors from alpha particles in packaging materials...
15 KB (1,799 words) - 14:36, 25 May 2025
Deformations and Stresses in IC Packages During Manufacturing Process". IEEE Transactions on Components and Packaging Technologies. 29 (3): 625–635. doi:10...
10 KB (1,059 words) - 21:51, 19 June 2025
Dicing tape (section Advanced Tape Technologies)
Dicing Tape When Used in a Plasma Dicing Environment". IEEE Transactions on Components, Packaging and Manufacturing Technology. 10 (4): 694–703. doi:10...
11 KB (1,255 words) - 21:39, 6 June 2025
IEEE Trans. Robot. Autom., 17 (4): 507–515, doi:10.1109/70.954764 E. Malis, F. Chaumette and S. Boudet, 2.5 D visual servoing, IEEE Transactions on Robotics...
27 KB (4,026 words) - 06:51, 22 November 2024
Atsumi; K. Fukumitsu (August 2007). "Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing". IEEE Transactions on Semiconductor Manufacturing. 20...
11 KB (1,284 words) - 20:15, 24 May 2025
Mohamad Sawan (category Fellows of the IEEE)
co-founder, including the IEEE NEWCAS, ICECS, and BioCAS. He is co-founder and was the editor-in-chief of the IEEE Transactions on Biomedical Circuits and...
18 KB (1,859 words) - 15:42, 23 May 2025
electromagnetic wave scattering using an on-surface radiation boundary condition approach" (PDF). IEEE Transactions on Antennas and Propagation. 35 (2): 153–161...
60 KB (5,367 words) - 02:32, 6 July 2025