IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology...
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IEEE Access Advanced Packaging, IEEE Transactions on Aerospace and Electronic Systems, IEEE Transactions on Affective Computing, IEEE Transactions on...
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capacitor selection for modern CMOS technology". IEEE Transactions on Advanced Packaging. 22 (3). IEEE: 284–291. doi:10.1109/6040.784476. ISSN 1557-9980...
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integrated circuit (2.5D IC) is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into...
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Directed assembly of micro- and nano-structures (section Self-assembled monolayers on solid substrates)
fabrication of nano-scale electronic and photonic devices". IEEE Transactions on Advanced Packaging. 26 (3): 233–241. doi:10.1109/TADVP.2003.817971. Xu, Feng;...
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Surface activated bonding (category Packaging (microfabrication))
electrodes by means of surface-activated bonding (SAB) method". IEEE Transactions on Advanced Packaging. 29 (2): 218–226. doi:10.1109/TADVP.2006.873138. ISSN 1521-3323...
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Electronics Engineers (IEEE) Transactions of Advanced Packaging Commendable Paper Award, 2004 Transactions on Components and Packaging Technologies Best...
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Veeco (category Companies listed on the Nasdaq)
the global ALD market. Advanced packaging systems include: Lithography tools used for copper pillar, fan-out wafer-level packaging (FOWLP) through-silicon...
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Graphics Player for Constrained Devices". IEEE Transactions on Consumer Electronics. 54 (2). IEEE Transactions on Consumer Electronics (Vol. 54 issue 2):...
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Semiconductor device fabrication (category Commons category link is on Wikidata)
end, post-fab, ATMP (Assembly, Test, Marking, and Packaging) or ATP (Assembly, Test and Packaging) of semiconductor manufacturing, and may be carried...
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Linda Katehi (category People appearing on C-SPAN)
improving isolation in LTCC RF and wireless multichip packages". IEEE Transactions on Advanced Packaging. 23 (1): 88–99. CiteSeerX 10.1.1.454.5791. doi:10...
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Synaptic Package Manager provides a graphical user interface by using the Advanced Packaging Tool (apt) library, which, in turn, relies on dpkg for core...
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Transportation in Nanotechnology—Potentials and Challenges". IEEE Transactions on Advanced Packaging. 28 (4): 547–555. doi:10.1109/TADVP.2005.858309. S2CID 33608087...
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Integrated circuit (category Commons category link is on Wikidata)
techniques are collectively known as advanced packaging. Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as...
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Electromagnetic Interference (EMI) of System-on-Package (SOP). Advanced Packaging, IEEE Transactions on. 27. 304 - 314. 10.1109/TADVP.2004.828817. Nandivada...
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require single chip packaging. Wafer-level packaging is implemented before wafer dicing, as shown in Fig. 3(a), and is based on anodic, metal diffusion...
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Harry Kroger (category Fellows of the IEEE)
IEEE Transactions on Advanced Packaging. 25: 12–17. doi:10.1109/TADVP.2002.1017679. "Inside Binghamton University". Archived from the original on 2006-09-07...
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Filter Design and Fabrication Using IPD Technology". IEEE Transactions on Components and Packaging Technologies. 30 (4): 556–562. doi:10.1109/TCAPT.2007...
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IEEE Trans. Robot. Autom., 17 (4): 507–515, doi:10.1109/70.954764 E. Malis, F. Chaumette and S. Boudet, 2.5 D visual servoing, IEEE Transactions on Robotics...
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paper in the IEEE Transactions on Nuclear Science journal in 1975. In 1978, the first evidence of soft errors from alpha particles in packaging materials...
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micromechanics on silicon: Techniques and devices". IEEE Transactions on Electron Devices. 25 (10). Institute of Electrical and Electronics Engineers (IEEE): 1241–1250...
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Three-dimensional integrated circuit (category Packaging (microfabrication))
Weber, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol. 19, No. 4 (1996) "HOME". Archived from the original on December...
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Deformations and Stresses in IC Packages During Manufacturing Process". IEEE Transactions on Components and Packaging Technologies. 29 (3): 625–635. doi:10...
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method for modeling circuits and interconnects for electronic packaging," in IEEE Transactions on Microwave Theory and Techniques, vol. 45, no. 10, pp. 1868–74...
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original on 11 January 2014. Weldon, Wm. F.; Driga, M. D. & Woodson, H. H. (November 1986). "Recoil in electromagnetic railguns". IEEE Transactions on Magnetics...
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Through-silicon via (section 3D packages)
"Thru-silicon vias for 3D WLP". Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)...
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Atsumi; K. Fukumitsu (August 2007). "Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing". IEEE Transactions on Semiconductor Manufacturing. 20...
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electromagnetic wave scattering using an on-surface radiation boundary condition approach" (PDF). IEEE Transactions on Antennas and Propagation. 35 (2): 153–161...
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"IEEE Transactions on Automation Science and Engineering Best New Application Paper Award (Sponsored by Googol Technology Ltd) About the Award". IEEE....
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characteristic impedance of planar transmission lines," IEEE Transactions on Advanced Packaging, Vol. 26, pp. 165-171, 2003. (See the biographies at the...
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