Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9...

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...

conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large...

were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic...

its re-implementation using modern silicon transistors and the newer Flip-Chip module packaging to produce the PDP-10. The instruction sets of the two machines...

Equipment Corporation's Logic Handfbook Flip Chip™ Modules 1969 edition calls transparent RS latches as "R/S Flip Flops" (http://www.bitsavers...

use wire wrap, as well as being the first to use the proprietary DEC Flip-Chip module which was invented in the same year. Feature also applies to concepts...

device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization...

may be used on both the PCB and the package. Also, in stacked multi-chip modules, (package on package) solder balls are used to connect two packages....

for the PDP-4; DEC's first wire-wrapped machine using the associated Flip-Chip module form-factor. It was introduced in 1964, and a second version, the 7A...

communication between modules on the same chip. This has led to an exploration of so-called Network-on-Chip (NoC) devices, which apply system-on-chip design methodologies...

multiple companies. The original memory modules were built upon ceramic substrates with 64K Hitachi "flip chip" parts and had pins, i.e. single in-line...

the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they...

package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or...

architecture which means that the processor is a multi-chip module. Tim Wilson led the system on a chip development for this generation microprocessor. In...

connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead...

The Samsung Galaxy Z Flip (sold as Samsung Galaxy Flip in certain territories) is an Android-based foldable smartphone developed by Samsung Electronics...

high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives...

be an inverter or flip-flop, which would require two or more transistors and a small number of additional supporting devices. Modules would be inserted...

Lincoln Laboratory. Retrieved 2011-09-09. The Digital Logic Handbook Flip Chip Modules. Digital Equipment Corporation. 1967. 1750·3/67. Retrieved 2008-03-08...

embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging...

flip-chip plastic land grid array (FC-PLGA) packages: one single chip module (SCM) and two dual-chip modules (DCM and eSCM). SCM, single chip module –...

Deschutes core in a flip-chip package with a 512 KB full-speed L2 cache chip from the Pentium II Xeon into a Socket 8-compatible module resulted in a 300...

traditionally required for this work. These modules were in the company's M series of Flip-Chip modules, which used TTL circuit technology. The economic...

rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system...

to manufacture. Wire bonding can be used instead of techniques such as flip-chip to reduce costs. Early integrated circuits were packaged in ceramic flat...

socket Chip carrier Dual in-line package (DIP) Pin grid array (PGA) Ball grid array (BGA) Compression Attached Memory Module (CAMM), a memory module form...

structure inside a package that connects the chip to its leads mask – see photomask MCM – see multi-chip module microbump – a very small solder ball that...

LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake...

discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk-screened resistors on a ceramic substrate, forming an SLT module. The circuits...