Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to...
13 KB (1,789 words) - 19:31, 18 February 2025
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume...
7 KB (880 words) - 23:43, 30 January 2025
are mostly wave soldered or reflow soldered, though hand soldering of production electronics is also still widely used. In wave soldering, components are...
64 KB (8,960 words) - 20:23, 29 June 2025
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which...
10 KB (1,188 words) - 22:37, 18 July 2025
hand (tool) Solder Soldering Wave soldering Reflow soldering Restriction of Hazardous Substances Directive (RoHS) Non-Newtonian fluid "Solder-Paste Printer"...
17 KB (1,992 words) - 18:57, 3 July 2025
susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. The MSL is an electronic standard for the...
5 KB (800 words) - 06:51, 16 May 2025
JST connector (section Soldering)
temperatures required for reflow soldering, because the plastic has a lower melting point since they were designed for wave soldering methods. Some JST surface-mount...
12 KB (558 words) - 13:41, 21 March 2025
which requires tighter controls on soldering. At the end of 2008, convection soldering was the most popular reflow technology using either standard air...
34 KB (4,396 words) - 20:07, 23 June 2025
or SAC) solders are used by two-thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering. The widespread...
39 KB (4,933 words) - 02:45, 29 June 2025
counts and pin densities. Each socket technology will have specific reflow soldering requirements. As CPU and memory frequencies increase, above 30 MHz...
33 KB (733 words) - 03:27, 17 June 2025
wave solder: These tools mask off areas previously soldered in the SMT reflow soldering process, exposing only those areas to be selectively soldered in...
7 KB (854 words) - 23:41, 30 January 2025
manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages. Historically...
4 KB (513 words) - 13:01, 13 June 2025
needed] Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens...
17 KB (2,026 words) - 23:54, 20 June 2025
Graping (category Soldering defects)
viscosity of the flux decreases as the temperature of the reflow oven increases. Lead-free reflow soldering temperatures are higher, which results in more graping...
3 KB (401 words) - 08:03, 9 November 2024
Flux (metallurgy) (redirect from Soldering flux)
heating of the joint by the soldering tool. In high-temperature metal joining processes (welding, brazing and soldering), fluxes are nearly inert at...
48 KB (5,560 words) - 16:54, 25 May 2025
Thermal profiling (category Brazing and soldering)
an effective soldering process, soldering must be carried out under carefully calibrated conditions in a reflow oven. Convection Reflow Oven Detailed...
15 KB (1,933 words) - 00:16, 5 March 2025
Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board...
10 KB (1,298 words) - 20:29, 21 May 2025
boards that are soldered automatically using reflow or wave soldering techniques. Once applied, openings must be made in the solder mask wherever components...
8 KB (706 words) - 13:45, 23 May 2025
assembly, to prevent water absorption that could flash into steam during reflow soldering, destroying the part. A simple dry box can consist of nothing more...
3 KB (438 words) - 04:52, 15 April 2025
the wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure...
70 KB (1,880 words) - 15:55, 13 June 2025
Process window index (category Brazing and soldering)
is soldering. In soldering, a thermal profile is the set of time-temperature values for a variety of processes such as slope, thermal soak, reflow, and...
11 KB (1,328 words) - 13:48, 5 February 2025
Tin-silver-copper (category Brazing and soldering)
SMT Soldering Defects: How to Prevent Them, mirror: Lead-Free Defects in Reflow Soldering – How to Prevent Them, emsnow, Feb 17, 2005 Lead-Free Solder FAQ’s...
7 KB (855 words) - 15:13, 8 September 2023
Organic Solderability Preservative (OSP) Reflow soldering Wave soldering Salleh, Mohd Arif Anuar Mohd (2022). Recent Progress in Lead-Free Solder Technology:...
2 KB (177 words) - 18:44, 16 February 2025
fragile components. As it can sustain the temperature needed for a reflow soldering operation, its protection is available throughout the whole production...
15 KB (1,659 words) - 10:16, 22 March 2025
function of curing and drying ovens. Reflow Ovens – A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components...
4 KB (385 words) - 11:44, 28 February 2025
removed or stripped. Then the solder on the chips undergoes solder reflow to form the bumps into their final shape. Solder balls are often 75 to 500 microns...
16 KB (1,777 words) - 00:34, 20 June 2025
Solder reflow Adhesive underfill Final result Head-in-pillow defect, a solder ball failure Definition of: solder ball, PC Magazine glossary Soldering...
3 KB (268 words) - 21:52, 27 January 2025
Stencil printing (redirect from Solder paste mask)
placement and solder reflow. The tackiness of the paste enables the components to stay in place. A good solder joint is one where the solder paste has melted...
21 KB (2,720 words) - 15:19, 24 May 2025
fine-tip soldering iron, for small volume prototypes. Selective soldering may be used for delicate parts. Some SMT parts cannot be soldered by hand, such...
35 KB (4,575 words) - 04:06, 21 July 2025
electronic components are placed and soldered, for example by SMT placement equipment and wave or reflow soldering. ODB++ can handle all the specifications...
31 KB (2,571 words) - 04:55, 17 July 2025