mathematics, more precisely in differential geometry, a soldering (or sometimes solder form) of a fiber bundle to a smooth manifold is a manner of attaching...

Solder (UK: /ˈsɒldə, ˈsəʊldə/; NA: /ˈsɒdər/) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order...

Soldering (US: /ˈsɒdərɪŋ/; UK: /ˈsoʊldərɪŋ/) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process...

of a vector-valued 1-form on F M {\displaystyle FM} called the solder form (also known as the fundamental or tautological 1-form). Let x {\displaystyle...

A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering...

The main tensorial invariant of a connection form is its curvature form. In the presence of a solder form identifying the vector bundle with the tangent...

The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solderability requires wetting...

∗ M {\displaystyle T^{*}M} and solders them together, in that d ϕ {\displaystyle \mathrm {d} \phi } is a solder form. In this sense, the interpretation...

solder form. By convention, one uses the phrase "canonical form" whenever the form has a unique, canonical definition, and one uses the term "solder form"...

piece of data on the underlying G-bundle of a G-structure: the solder form. The solder form is what ties the underlying principal bundle of the G-structure...

Solder paste is a preparation of powdered solder in sticky flux paste primarily used to solder surface mount components onto printed circuit boards. It...

oxidation. For example, tin-lead solder attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing...

principal bundle is tied to the geometry of the base manifold using a solder form. Cartan connections describe the geometry of manifolds modelled on homogeneous...

The horizontal bundle is the kernel of the connection form. The solder form or tautological one-form vanishes on the vertical bundle and is non-zero only...

+\omega \wedge \theta } where θ {\displaystyle \theta } is the solder form (tautological one-form). The subscript ω {\displaystyle \omega } serves only as a...

Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which...

protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads. A solder bridge is an unintended electrical connection...

{\displaystyle D\mathbf {e} _{i}=\mathbf {e} _{j}{\omega ^{j}}_{i}.} The solder form for the tangent bundle (relative to this frame) is the dual basis θi...

Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical...

Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly...

being unnecessary for the specification of a tetrad. Each covector is a solder form. From the point of view of the differential geometry of fiber bundles...

integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact...

Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress...

structure of the solder form θ, which is an equivariant Rn-valued 1-form on P, should be taken into account. In particular, the torsion form on P, is an Rn-valued...

Ultrasonic soldering (U/S soldering) is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials,...

A soldering gun is an approximately pistol-shaped, electrically powered tool for soldering metals using tin-based solder to achieve a strong mechanical...

across the tip; e.g. metallic contacts, or solder. With a current flowing, the resistance of both the solder and the tip produces enough heat to increase...

equals the dimension of M {\displaystyle M} and a solder form has been chosen, one can use the soldering to interchange the indices and define a notion of...

cotangent bundle; i.e. given by forms). The tautological one-form is a special case of the more general solder form, which provides a (co-)frame field...

of fiber bundle, and the related notions of Ehresmann connection and solder form, building on the works by Herbert Seifert and Hassler Whitney in the...