• Thermomechanical analysis (TMA) is a technique used in thermal analysis, a branch of materials science which studies the properties of materials as they...
    19 KB (2,737 words) - 23:57, 19 August 2024
  • material Thermomechanical analysis Dielectric thermal analysis Time–temperature superposition Electroactive polymers "What is Dynamic Mechanical Analysis (DMA)...
    20 KB (2,803 words) - 21:50, 4 December 2024
  • Thumbnail for Thermogravimetric analysis
    Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis in which the mass of a sample is measured over time as...
    17 KB (1,677 words) - 21:08, 14 July 2025
  • analysis: thermal diffusivity and thermal conductivity Thermogravimetric analysis: mass change versus temperature or time Thermomechanical analysis:...
    13 KB (1,753 words) - 12:35, 6 September 2024
  • Differential thermal analysis (DTA) is a thermoanalytic technique that is similar to differential scanning calorimetry. In DTA, the material under study...
    8 KB (932 words) - 18:17, 27 April 2024
  • lens spectroscopy, a type of photothermal spectroscopy TMA – Thermomechanical analysis TOF-MS – Time-of-flight mass spectrometry Two-photon excitation...
    15 KB (1,398 words) - 20:21, 9 November 2024
  • Thumbnail for Differential scanning calorimetry
    throughout the experiment. Generally, the temperature program for a DSC analysis is designed such that the sample holder temperature increases linearly...
    29 KB (3,627 words) - 09:47, 24 June 2025
  • tense–aspect–mood, grammatical system Tetramethylammonium ion or its salts Thermomechanical analysis Third man argument, a philosophical criticism of Plato's theory...
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  • ammunition STANAG 4525 Explosives, Physical/Mechanical Properties, Thermomechanical Analysis for Determining the Coefficient of Linear Thermal Expansion (TMA)...
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  • on an explosive is primarily thermomechanical, at higher temperatures it is primarily thermochemical. Thermomechanical mechanisms involve stresses by...
    19 KB (1,176 words) - 09:49, 9 June 2025
  • Thumbnail for Electric arc furnace
    P.; Strydom, C. A.; Dawson, N. F. (1 June 2013). "The use of thermomechanical analysis to characterise Söderberg electrode paste raw materials". Minerals...
    35 KB (4,857 words) - 09:48, 23 April 2025
  • Thumbnail for Thermomechanical generator
    low losses. These low-loss operating characteristics simplify the engine analysis, compared to more conventional Stirling engines.: 113  The design has many...
    6 KB (761 words) - 01:54, 5 January 2025
  • Neomagus HW, Strydom CA, Dawson NF (June 2013). "The use of thermomechanical analysis to characterise Söderberg electrode paste raw materials". Minerals...
    36 KB (3,542 words) - 21:32, 15 July 2025
  • Dielectric thermal analysis (DETA), or dielectric analysis (DEA), is a materials science technique similar to dynamic mechanical analysis except that an oscillating...
    2 KB (223 words) - 20:00, 31 December 2023
  • Thumbnail for Polymer characterization
    differential thermal analysis, thermomechanical analysis, dynamic mechanical thermal analysis, and dielectric thermal analysis. Dynamic mechanical spectroscopy...
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  • transfer load to the specimen, such as dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA), is difficult to do with consistency. Accurate...
    9 KB (975 words) - 05:32, 29 June 2025
  • key difference in evaluating chemical exergy versus thermomechanical exergy is that thermomechanical exergy does not take into account the difference in...
    82 KB (11,050 words) - 06:34, 1 July 2025
  • Thermography Thermogravimetric analysis Thermoluminescence Thermoluminescent Dosimeter Thermomagnetic convection Thermomechanical analysis Thermometer Thermomigration...
    19 KB (2,020 words) - 14:34, 30 November 2024
  • Thumbnail for Calculix
    Guido Dhondt: "The Finite Element Method for Three-Dimensional Thermomechanical Applications". Wiley, Hoboken 2004, ISBN 0-470-85752-8 CCX v2.18 documentation...
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  • solder joints). Repeated temperature cycling eventually leads to thermomechanical fatigue. The deformation characteristics of various solder alloys can...
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  • silicon cantilevers to probe thermomechanical properties of materials with sub-100 nm spatial resolution. Localised thermal analysis of a packaging film, Price...
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  • Thumbnail for Wire bonding
    is not as common in other metal systems. Under temperature cycling, thermomechanical stress is generated in the wire bond as a result of coefficient of...
    22 KB (2,563 words) - 22:57, 18 July 2025
  • like: Metals, below and above yield point Composite materials Gaskets Thermomechanical shape memory alloys Soils Powder metals Concrete Elastomers Plastics...
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  • referred to as microvia pull out). These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch...
    10 KB (1,350 words) - 19:15, 7 July 2025
  • Thumbnail for Ball-on-ring test
    ball-on-ring test using finite element analysis". 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. pp...
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    especially thermomechanical fatigue due to thermal cycling. The significantly lower standoff in QFN packages can lead to higher thermomechanical strains...
    15 KB (1,875 words) - 07:37, 21 January 2025
  • Thumbnail for Krzysztof Wilmanski
    the balance equation of porosity (publication list) Wilmanski, K.: Thermomechanics of Continua, Springer, Berlin, N.Y., 1998, ISBN 978-3540641414. Wilmanski...
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    success, along with steam explosion and chemical processing known as thermomechanical pulping.[citation needed] Hemp is usually planted between March and...
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  • Thumbnail for Bauschinger effect
    Bauschinger effect to reduce its impact. Heat Treatment: Heat treatment and thermomechanical processing are widely used to mitigate the Bauschinger effect by relieving...
    19 KB (2,277 words) - 23:56, 15 July 2025
  • frit-bonded sensors". The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. pp. 1343–1348....
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