A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount...
17 KB (2,026 words) - 23:54, 20 June 2025
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular...
10 KB (967 words) - 16:44, 20 November 2024
LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Like pin grid arrays, land grid array packages are designed to fit...
9 KB (1,255 words) - 12:19, 14 July 2025
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial...
5 KB (656 words) - 16:32, 23 June 2024
qualify these packages as CSPs is their ball pitch should be no more than 1 mm. Chip-scale package Ball grid array (BGA) uses the underside of the package...
62 KB (3,442 words) - 15:44, 29 May 2025
Zero insertion force (section Ball grid array sockets)
devices of differing widths to be inserted. ZIF sockets can be used for ball grid array chips, particularly during development. These sockets tend to be unreliable...
6 KB (822 words) - 21:09, 3 November 2024
solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. Ball grid array, chip-scale...
3 KB (268 words) - 21:52, 27 January 2025
Integrated circuit packaging (redirect from Area array package)
packages to land grid array (LGA) packages. Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages...
15 KB (1,590 words) - 06:50, 22 April 2025
Card) SSDs. In the early 2000s, a few companies introduced SSDs in Ball Grid Array (BGA) form factors, such as M-Systems' (now SanDisk) DiskOnChip and...
127 KB (11,151 words) - 15:06, 16 July 2025
ICL Integrated circuit packages: Ball grid array pin grid array land grid array Processor array Programmable Array Logic (PAL), a systematic way to implement...
4 KB (504 words) - 22:59, 23 July 2024
equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate...
10 KB (1,298 words) - 20:29, 21 May 2025
The standard encompasses both packages permanently embedded (via ball grid array package) within a device (eUFS), and removable UFS memory cards. UFS...
26 KB (2,231 words) - 14:47, 26 June 2025
pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not...
33 KB (733 words) - 03:27, 17 June 2025
used in Microsoft's Xbox console for the Xbox CPU, albeit in a BGA (ball grid array) format. It replaces Socket 615 (μPGA1), which was used in Pentium...
1 KB (104 words) - 12:32, 29 May 2024
interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto...
3 KB (370 words) - 22:06, 25 August 2023
used for high-end microprocessors. Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for a much...
82 KB (8,755 words) - 09:16, 14 July 2025
electronic components are also often called pins;[citation needed] in ball grid array packages, they are in form of small spheres, and are therefore called...
4 KB (487 words) - 16:03, 17 August 2024
packaging: through-hole metal, through-hole plastic, surface mount, ball grid array, power modules (see Packaging). Amplification factor hFE, βF (transistor...
99 KB (10,298 words) - 03:45, 24 June 2025
The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). The figure shows the cross section of a flat no-lead package...
15 KB (1,875 words) - 07:37, 21 January 2025
outperformed high-Pb solders C4 joints in ceramic ball grid array (CBGA) systems, which are ball-grid arrays with a ceramic substrate. The CBGA showed consistently...
7 KB (855 words) - 15:13, 8 September 2023
circuits (ICs). This is mostly commonly done on solder joints for ball grid array (BGA) components, although in some cases it can be done with other...
5 KB (485 words) - 18:52, 30 December 2024
(PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory. Two or more packages...
13 KB (1,373 words) - 09:31, 26 January 2025
(up to 96 execution units) Packages Flip-chip land grid array (FC-LGA) Flip-chip ball grid array (FC-BGA) Sockets Desktop/Server: LGA 1700 Mobile: BGA...
81 KB (3,392 words) - 15:39, 13 July 2025
Cores 1, 2, or 4 Packages Flip-chip land grid array (FC-LGA) Micro pin grid array (mPGA) Flip-chip ball grid array (FC-BGA) Sockets Socket T (LGA 775) Socket...
17 KB (1,159 words) - 18:43, 26 May 2025
cache bus required more pins and thus a different package, a 360-pin ball grid array (BGA). The PowerPC 750 was used in many computers from Apple, including...
22 KB (2,226 words) - 22:09, 5 July 2025
and have sufficient spacing so that they can be handled just like a ball grid array (BGA) package. The RDL is often made out of a polyamide or polybenzoxazole...
6 KB (724 words) - 23:58, 25 October 2024
It was packaged in a 240-pin metal quad flat package or a 256-ball plastic ball grid array. The StrongARM latch is an electronic latch circuit topology...
20 KB (2,622 words) - 22:38, 26 June 2025
Head-in-pillow defect (redirect from Ball-and-socket (electronics))
called ball-and-socket, is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on...
3 KB (389 words) - 19:10, 30 December 2024
BGA with an interposer between the integrated circuit die to ball grid array...
6 KB (507 words) - 01:24, 4 June 2025
one or more microprocessors may be installed. In the case of CPUs in ball grid array packages, such as the VIA Nano and the Goldmont Plus, the CPU is directly...
26 KB (3,047 words) - 03:16, 7 July 2025