• Thumbnail for Dual in-line package
    In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical...
    23 KB (3,249 words) - 00:05, 17 February 2024
  • Thumbnail for DIP switch
    switch is a manual electric switch that is packaged with others in a group in a standard dual in-line package (DIP). The term may refer to each individual...
    9 KB (1,066 words) - 20:25, 14 November 2023
  • Thumbnail for Small outline integrated circuit
    surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness...
    10 KB (1,015 words) - 09:45, 1 May 2022
  • Thumbnail for DIMM
    A DIMM, or Dual In-Line Memory Module, is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front...
    22 KB (1,993 words) - 14:00, 7 May 2024
  • Thumbnail for Pin grid array
    PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). The chip can be mounted either on the top or the...
    10 KB (967 words) - 19:02, 23 February 2024
  • Thumbnail for Integrated circuit packaging
    axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s VLSI pin counts...
    15 KB (1,597 words) - 20:25, 22 April 2024
  • Thumbnail for List of integrated circuit packaging types
    surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness...
    62 KB (3,406 words) - 20:21, 15 May 2024
  • Thumbnail for LM386
    amplifiers, and hobby electronics projects. The IC consists of an 8-pin dual in-line package (DIP-8) and can output 0.25 to 1 watts of power, depending on the...
    5 KB (472 words) - 00:11, 1 October 2023
  • Thumbnail for Zig-zag in-line package
    zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP)...
    3 KB (343 words) - 19:57, 24 April 2023
  • made in ceramic and plastic dual in-line package(s) and in flat-pack form. Some TTL chips are now also made in surface-mount technology packages. TTL...
    31 KB (3,919 words) - 15:43, 12 February 2024
  • Thumbnail for Quad in-line package
    counts, through the early 1990s. The QIP has the same dimensions as a Dual in-line package (DIP), but the leads on each side are bent into an alternating zigzag...
    4 KB (385 words) - 23:15, 1 December 2023
  • Thumbnail for Lead (electronics)
    mount packages with leads – such as Small Outline Integrated Circuit Quad Flat Package  – and for through-hole packages such as dual in-line package  – and...
    4 KB (487 words) - 10:33, 7 April 2024
  • in the Linux Virtual Server Distributed information processing Document image processing Dual in-line package, a type of integrated circuit packaging...
    4 KB (547 words) - 11:56, 19 December 2023
  • beer made by New Belgium Brewing Company Skinny DIP, a narrow dual in-line package in the field of electronics The Skinny Dip, a Canadian adventure television...
    535 bytes (103 words) - 21:57, 12 May 2024
  • Thumbnail for Memory module
    package (ZIP) DRAM (memory) modules Single In-line Pin Package (SIPP) Single In-line Memory Module (SIMM) Dual In-line Memory Module (DIMM) Rambus In-line...
    7 KB (767 words) - 03:46, 23 April 2024
  • Thumbnail for ATmega88
    the basic Atmel AVR instruction set. One of the packaging configurations is the dual in-line package (DIP). It has 23 I/O pins and operates at up to 20...
    3 KB (162 words) - 07:28, 22 November 2023
  • assembly underneath cuts and bends the leads opposite to each other. A dual in-line (DIP) inserter takes integrated circuits from tubes which are loaded...
    3 KB (375 words) - 19:02, 15 March 2023
  • Thumbnail for K1810VM86
    K1810VM86 (category Computing in the Soviet Union)
    manufactured plastic 40-pin dual in-line package (as KR1810VM86 / КР1810ВМ86) or in a 40-pin ceramic dual in-line package (as KM1810VM86 / КМ1810ВМ86...
    10 KB (660 words) - 07:32, 13 January 2024
  • Thumbnail for Commodore 64
    Commodore 64 (category Products introduced in 1982)
    heat, forcing MOS Technology to use a ceramic dual in-line package known as a CERDIP. The ceramic package was more expensive, but dissipated heat more...
    114 KB (12,883 words) - 14:59, 8 May 2024
  • Thumbnail for ATmega328
    SPI serial port, 6-channel 10-bit A/D converter (8 channels in TQFP and QFN/MLF packages), programmable watchdog timer with internal oscillator, and 5...
    7 KB (511 words) - 21:41, 13 May 2024
  • Thumbnail for Western Digital FD1771
    circuitry that formerly had to be implemented in external components. Originally packaged as 40-pin dual in-line package (DIP) format, later models moved to a...
    6 KB (652 words) - 23:53, 14 May 2024
  • Thumbnail for Quad flat package
    integrated circuit pin arrangement design Dual in-line package Greig, William J. (2007). Integrated circuit packaging, assembly and interconnections. Springer...
    9 KB (1,158 words) - 05:03, 21 April 2024
  • Drug-induced lupus erythematosus, an autoimmune disorder Dual in-line package, a type of package for electronic chips Presidente Nicolau Lobato International...
    858 bytes (133 words) - 04:25, 15 July 2022
  • diced, wire-bonded, and packaged A plastic dual-in-line package containing an analog integrated circuit.This can be installed in a socket or directly soldered...
    13 KB (1,651 words) - 05:55, 21 April 2024
  • Thumbnail for AVR microcontrollers
    high-level languages. Among the first of the AVR line was the AT90S8515, which in a 40-pin DIP package has the same pinout as an 8051 microcontroller,...
    61 KB (7,318 words) - 17:06, 25 April 2024
  • Thumbnail for System in a package
    connecting dies or Small outline integrated circuit packages, use Dual in-line packages, or Single in-line packages for interfacing outside the Hybrid IC instead...
    9 KB (997 words) - 09:14, 23 April 2024
  • diagram of the 74HC266N, 74LS266 and CD4077 quad XNOR plastic dual in-line package 14-pin package (PDIP-14) ICs. Input A1 Input B1 Output Q1 (high if and only...
    10 KB (1,148 words) - 11:30, 29 March 2024
  • Thumbnail for Soviet integrated circuit designation
    Soviet integrated circuit designation (category Computing in the Soviet Union)
    Before the introduction of a package designation in 1980 the suffix П (P) was used in some series to indicate a plastic package (as opposed to the then more-common...
    89 KB (4,637 words) - 14:48, 29 January 2024
  • Thumbnail for RCA 1802
    some minor pin function changes, but the line continues to be produced in its original 40-pin dual in-line package (DIP) format.[when?] Joseph Weisbecker...
    53 KB (5,945 words) - 20:26, 15 May 2024
  • Thumbnail for SIMM
    connections. Dual in-line package (DIP) Single in-line package (SIP) Zig-zag in-line package (ZIP) Dual in-line memory module (DIMM) "What is DIMM(Dual Inline...
    17 KB (1,385 words) - 15:13, 3 May 2024